IT House March 31 news, according to Shenzhen Stock Exchange documents, BYD Semiconductor Co., Ltd. due to IPO application documentsThe recorded financial information has expiredneed to submit supplementary submission, according to the relevant provisions of the “Shenzhen Stock Exchange GEM Share Issuance and Listing Review Rules”, Shenzhen Stock Exchange suspends its issuance and listing review.
On January 20, according to the announcement of the 5th review meeting of the Shenzhen Stock Exchange’s Entrepreneurship and Listing Committee in 2022, BYD Semiconductor Co., Ltd. (hereinafter referred to as: BYD Semiconductor) will be listed on the GEM board on January 27.
IT House learned that the prospectus shows that BYD Semiconductor intends to raise funds in this IPO. 2.686 billion yuaninvest in the construction of new power semiconductor chip industrialization and upgrading projects, power semiconductor and intelligent control device research and development and industrialization projects, and supplement working capital.
BYD Semiconductor believes that the use of funds raised this time is closely related to its main business. Under the circumstance that the global automotive-grade semiconductor wafer production capacity continues to be in short supply, it will ensure the stable supply of wafers through self-built production lines and capacity expansion to achieve The autonomous and controllable key production steps of power semiconductors and intelligent control ICs consolidate and enhance the company’s market position and comprehensive competitiveness.
In the fields of industry, home appliances, new energy, and consumer electronics, BYD Semiconductor has mass-produced IGBT, IPM, MCU, CMOS image sensors, embedded fingerprint sensors, electromagnetic sensors, power ICs, LED lighting and displays.
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