It is revealed that the MediaTek Dimensity 9000 chip is testing the high-frequency version, the X2 super core is raised to 3.2GHz, and the Snapdragon 8 Gen 1 + also has a high-frequency version

IT House reported on April 9 that MediaTek released the Dimensity 9000 series before, and subsequently released the Dimensity 8000 and Dimensity 8100 chips. At present, related new mobile phone products have been released and launched one after another. Dimensity 8100 can be regarded as a high frequency version of Dimensity 8000. Now it is reported that the Dimensity 9000 will also have a high-frequency version.

According to Weibo blogger @Digital Chat Station, the Dimensity 9000 is testing the high-frequency version, and the X2 super core has been raised from 3.05GHz to 3.2GHz. In addition, the SM8475 QRD is also testing the high-frequency version, and the Dimensity 8100 chip wins. The SM8475 is the Snapdragon 8 Gen 1 + chip, a small iterative version of the Snapdragon 8 Gen 1 chip, using a 4nm process.

In December 2021, MediaTek released the Dimensity 9000 chip, which is the first to adopt TSMC’s 4nm advanced process. The CPU adopts the new generation Armv9 architecture for the next ten years, including one Arm Cortex-X2 ultra-large core with a main frequency of up to 3.05GHz, three Arm Cortex-A710 core with a main frequency of up to 2.85GHz and 4 Arm Cortex-A510 energy efficiency cores with a main frequency of 1.8GHz, built-in 14MB large-capacity cache combination.compared to 2021androidFlagship, with a 35% increase in performance and a 37% increase in energy efficiency.

At the beginning of March this year, the Dimensity 8100 chip was released, TSMC 5nm process, the CPU part contains 4 2.85GHz A78 cores + 4 2.0GHz A55 cores, the GPU is Mali-G610, and adopts the self-developed APU 580 architecture. In the CPU running part, the Dimensity 8100 claims to have a 12% increase in multi-core performance and a 44% increase in multi-core energy efficiency compared to competing products at the same level.