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Previously, a new Huawei phone model PAL-AL00 was connected to the network, only supports 4G, and is pre-installed with Hongmeng OS. It is reported that the phone is likely to be Huawei’s new generation of folding mobile phone Mate X3.

According to reports,Huawei Mate X3 engineering machine parameters include Kirin 9000 4G chip, full-height screen, 4500mAh battery, and HarmonyOS 2.0.1 system.

Today, the digital blogger @王子智通 revealed that,Huawei Mate X3 has a Snapdragon 888 version, and the new phone will be released at the end of April.

More than Kirin 9000! Expose Huawei's folding flagship Mate X3 to use Snapdragon 888

It is reported that at the beginning of the release of the Huawei P50 series, a mixed processor was adopted. The standard version of the P50 is uniformly equipped with the Snapdragon 888 4G, and the P50 Pro 128GB version is also the Snapdragon 888 4G. Only the 256/512GB version is pure. Kirin 9000.

It is expected that Huawei Mate X3 will also adopt a mixed processor solution this time, that is, the Kirin 9000 4G version will be available in limited quantities.

in addition,It is reported that Huawei Mate X3 will return to the folding design, similar to Huawei Mate X/Xs,It adopts the punch hole design on the right side.

It is worth mentioning that the blogger @Factory Director Shi Guan once said that the hinge structure of the new folding screen has some adjustments compared to the Mate X2. According to various understandings, the new phone may not be a wedge-shaped design, and the left and right are symmetrical. The scheme and lens part are similar to the parameters of the P50 series.

More than Kirin 9000! Expose Huawei's folding flagship Mate X3 to use Snapdragon 888

If you need to reprint, please be sure to indicate the source: Fast Technology

Responsible editor: Shi Qiarticle error correction

Hashtags: Huawei Snapdragon 888Huawei Mate X3

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